D.P.A.
e-Certa, Inc. Internal Visual Verification Analysis

Client	Test Report, Inc.
DPA#	1002EC
Part Identification	SA7025DK-T
Manufacturer	Philips
P.O. #
Date Code	9432
Quantity	1
Package Type

Lot Disposition

Submitted By: ____________________

___ Meets Requirements

Reviewed By: ____________________

___ Does Not Meet Requirements

Approved By: ____________________

___ Customer Review

Analysis Procedure/Results:

Manufacturer: Philips	Part Number: SA7025DK	D.P.A. Number: 1002EC	Customer: Test Report., Inc.
Part Type: Chip	Date Code: 9432	Quantity: 1

Inspection Performed per: Mil-Std 883 Method 2013
Discrepancies : ___Yes _X_No

Sample #:
Anomaly:
Anomaly:
Anomaly:
Anomaly:

30x-60x Magnification
a. improper substrate or bonding post plating material
b. improper bond wire material or size
c. metallic contamination or foreign material
d. lifted or broken wires
e. lifted, cracked or broken die/substrate
f. improper die mounting
g. excessive lead wire loop or sag
h. improper bond technique and size
i. improper assembly die location and orientation as compared to the applicable assembly drawing
j. particles other than those introduce during opening

75x-150x Magnification
k. metalization voids, corrosion, peeling, lifting, blistering or scratches
l. bond inter-metallics extending radially more than 0.1 mil beyond the bond periphery in any direction
m. improper die or substrate metalization design layout, topography or identification
n. die cracks
o. logo does not match
p. die numbers do not match

	Figure: 1 Sample: 1 Magnification: 10x Subject: outside face view
	Figure: 2 Sample: 1 Magnification: 10x Subject: outside back view
	Figure: 3 Sample: 1 Magnification: 48x Subject: inside of de-lidded chip
	Figure: 4 Sample: 1 Magnification: 300x Subject: part number
	Figure: 4 Sample: 1 Magnification: 300x Subject: logo