1

Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

2

Mercury in straight fluorescent lamps for general purposes not exceeding:
- halophosphate 10 mg
- triphosphate with normal lifetime 5 mg
- triphosphate with long lifetime 8 mg

3

Mercury in straight fluorescent lamps for special purposes

4

Mercury in other lamps not specifically mentioned in this Annex

5

Lead in glass of cathode ray tubes, electronic components and fluorescent tubes

6

Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight

7

- lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications
- lead in electronic ceramic parts (e.g. piezoelectronic devices)

8

Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations

9

Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators

10

Lead used in compliant pin connector systems

11

Lead as a coating material for the thermal conduction module c-ring

12

Lead and cadmium in optical and filter glass

13

Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight

14

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages

1

Lead based alloys containing 85 % by weight or more lead

2

Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications

3

Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive

4

Lead used in compliant pin connector systems

5

Lead as a coating material for the thermal conduction module c-ring

6

Lead and cadmium in optical and filter glass

7

Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight

8

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages

1

Lead in tin whisker resistant coatings for fine pitch applications

2

Lead bound in glass, crystal glass, lead crystal or full lead crystal in general and Chromium (also in oxidation state (VI)) and Cadmium as colouring batch addition each form up to a content of 2 % in glass, crystal glass, lead crystal or full lead crystal used as decorative and / or functional part of electric or electronic equipment

3

Solders containing lead and/or cadmium for specific applications

4

Hexavalent chromium (CRVI) passivation coatings

5

Lead in lead oxide glass plasma display panels

6

Lead in connectors, flexible printed circuits, flexible flat cables

7

Lead oxide in lead glass, bonding materials of magnetic heads and magnetic heads

8

Cadmium as doping material in avalanche photodiodes (APDs) for the optical fiber communication systems

9

Lead in optical isolators

10

Lead in sheath heater of Microwaves

11

Cadmium pigments except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to the restriction on the marketing and use of certain substances

12

High Intensity Discharge (HID) lamps for professional U.V. applications, containing lead halide as radiant agent

13

Discharge lamps for special purposes containing lead as activator in the fluorescent powder (1% lead by weight or less)

14

Discharge lamps containing lead in the form of an amalgam

15

Mercury free flat panel lamp

16

Special purposes Black Light Blue (BLB) lamps, containing lead in the glass envelope

17

Low melting point alloys containing lead

18

Galvanised steel containing up to 0.35% lead by weight and aluminium with an unintended lead content up to 0.4% lead by weight in electrical and electronic equipment

19

Cadmium sulphide photocells

1

Linear incandescent lamp

2

Mercury in switches

3

Special ICs having tin-lead solder plating on leads used in professional equipment

4

Specific modular units including tin-lead solder being used in special professional equipment

5

Solders containing lead and / or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours

6

Lead in solder for printed circuit boards for emergency lighting products

7

Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment

8

Lead in gas sensors

9

Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lam

10

Cadmium in opto-electronic components

11

Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical / electronic components for safe control and operation

12

Electrical and electronic components contained in heating ventilation and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems

13

Cadmium-bearing copper alloys

14

Electrical / electronic components contained in mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor's air tools

15

Electrical / electronic equipment that are: used in transport-aviation, aerospace, road, maritime, rail; installed into the fabric of buildings – elevators, escalators, moving walks, dumb waiter, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications

16

Lead alloys as electrical / mechanical solder for transducers used in high-powered professional and commercial loudspeakers

17

Cadmium oxide

18

Solder tin of the thermo fuse with a defined low melting point

19

Lead in lead oxide glass used in plasma display panel (PDP)

20

Lead in solder on small PCB and tinned legs of primary components

21

Use of the not lead free component NEC V25 in the Memor 2000

22

Lead used in shielding of radiation for Non Medical X-ray equipment

23

Lead based solders sealed or captured within heat-shrinkable components and devices